AMD加强嵌入式产品组合，全新锐龙嵌入式5000系列处理器面向网络解决方案

AMD宣布其高性能AMD Ryzen™（锐龙）嵌入式5000系列产品启动供货，该新款解决方案适用于需要专为“永远在线（always on）”网络防火墙、网络附加存储系统和其他安全应用而优化的高能效处理器的客户。锐龙嵌入式5000系列完善了基于“Zen 3”的AMD嵌入式处理器产品组合，后者还包括锐龙嵌入式V3000和EPYC™（霄龙）嵌入式7000系列产品。

AMD锐龙嵌入式 5000系列处理器采用7纳米（7nm）技术打造，计划生产供货期为5年，并配备6、8、12或16个核心和24条PCIe®4连接通道，专为企业级可靠性所设计，从而支持安全和网络客户所需的持续正常运行要求。锐龙嵌入式5000系列处理器融入了强大的可靠性、可用性和可服务性（RAS）功能，包括一个支持纠错码（ECC）的内存子系统。锐龙嵌入式5000处理器的热设计功耗（TDP）范围为65W至105W，能够减少空间受限和成本敏感型应用的整体系统冷却占板面积。

AMD副总裁兼自适应与嵌入式计算事业部总经理Rajneesh Gaur表示：“锐龙嵌入式5000处理器为24x7安全和网络应用提供了所需的性能和可靠性的理想结合。我们嵌入式产品组合的这一扩展提供了一款中端解决方案，填补了我们的低功耗BGA锐龙嵌入式和我们卓越的EPYC嵌入式系列之间的空白，适用于同时需要高性能和多达16个核心可扩展性的客户。”

TIRIAS Research首席分析师Kevin Krewell表示：“AMD在嵌入式市场的成功建立在提供差异化和可扩展产品的基础上，这些产品可满足具有不同功耗、性能和环境要求的广泛应用。AMD锐龙嵌入式5000为从小尺寸嵌入式系统到存储、安全和网络系统的应用实现了功耗和性能的出色平衡，适合最广泛的客户群体和用例。”

· 多达16核心和32线程的可扩展性

· 高达64MB的共享L3 CPU高速缓存

· 65W至105W的高能效TDP

· 支持ECC的内存和安全功能

· 24条PCIe®4连接通道（使用AMD X570芯片组实现多达36条通道的可扩展I/O）

· 优化的性能提供企业级可靠性

AMD锐龙嵌入式5000系列处理器现正在产，计划生产供货期为5年。

· 进一步了解AMD“Zen 3”核心架构

· 进一步了解AMD锐龙嵌入式系列产品

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the five-year planned manufacturing availability of the AMD RyzenTM Embedded 5000 Series processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; global economic uncertainty; cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyber-attacks; potential difficulties in upgrading and operating AMD’s new enterprise resource planning system; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals-related provisions and other laws or regulations; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets on the combined company’s financial position and results of operation; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit facility; AMD's indebtedness; AMD's ability to generate sufficient cash to meet its working capital requirements or generate sufficient revenue and operating cash flow to make all of its planned R&D or strategic investments; political, legal, economic risks and natural disasters; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD’s stock price volatility; and worldwide political conditions. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

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AMD、AMD Arrow 标识、Ryzen 及其组合为超威半导体公司的商标。其它名称仅供参考之用，可能是其各自所有者的商标。