LED照明常用英文翻译对照

    LED照明常用词汇中英文对照(一)

    1backplane背板

    2Bandgapvoltagereference带隙电压参考

    3benchtopsupply工作台电源

    4BlockDiagram方块图5BodePlot波特图

    6Bootstrap自举

    7BottomFETBottomFET

    8bucketcapcitor桶形电容

    9chassis机架

    10Combi-senseCombi-sense

    11constantcurrentsource恒流源

    12CoreSataration铁芯饱和

    13crossoverfrequency交叉频率

    14currentripple纹波电流

    15CyclebyCycle逐周期

    16cycleskipping周期跳步

    17DeadTime死区时间

    18DIETemperature核心温度

    19Disable非使能，无效，禁用，关断

    20dominantpole主极点

    21Enable使能，有效，启用

    22ESDRatingESD额定值

    23EvaluationBoard评估板

    24Exceedingthespecificationsbelowmayresultinpermanent

    damagetothedevice,ordevicemalfunction.Operationoutsideofthe

    parametersspecifiedintheElectricalCharacteristicssectionisnot

    implied.

    超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电

    特性表规定的参数范围以外。

    25Faillingedge下降沿

    26figureofmerit品质因数

    27floatchargevoltage浮充电压

    28flybackpowerstage反驰式功率级

    29forwardvoltagedrop前向压降

    30free-running自由运行

    31Freewheeldiode续流二极管

    32Fullload满负载33gatedrive栅极驱动

    34gatedrivestage栅极驱动级

    35gerberplotGerber图

    36groundplane接地层

    37Henry电感单位：亨利

    38HumanBodyModel人体模式

    39Hysteresis滞回

    40inrushcurrent涌入电流

    41Inverting反相

    42jittery抖动

    43Junction结点

    44Kelvinconnection开尔文连接

    45LeadFrame引脚框架

    46LeadFree无铅

    47level-shift电平移动

    48Lineregulation电源调整率

    49loadregulation负载调整率

    50LotNumber批号

    51LowDropout低压差

    52Miller密勒53node节点

    54Non-Inverting非反相

    55novel新颖的

    56offstate关断状态

    57Operatingsupplyvoltage电源工作电压

    58outdrivestage输出驱动级

    59OutofPhase异相

    60PartNumber产品型号

    61passtransistorpasstransistor

    62P-channelMOSFETP沟道MOSFET

    63Phasemargin相位裕度

    64PhaseNode开关节点

    65portableelectronics便携式电子设备

    66powerdown掉电

    67PowerGood电源正常

    68PowerGroud功率地

    69PowerSaveMode节电模式

    70Powerup上电

    71pulldown下拉

    72pullup上拉

    73PulsebyPulse逐脉冲（PulsebyPulse）

    74pushpullconverter推挽转换器

    75rampdown斜降

    76rampup斜升

    77redundantdiode冗余二极管

    78resistivedivider电阻分压器

    79ringing振铃

    80ripplecurrent纹波电流

    81risingedge上升沿

    82senseresistor检测电阻

    83SequencedPowerSupplys序列电源

    84shoot-through直通，同时导通

    85strayinductances.杂散电感

    86sub-circuit子电路

    87substrate基板

    88Telecom电信

    89ThermalInformation热性能信息

    90thermalslug散热片

    91Threshold阈值

    92timingresistor振荡电阻

    93TopFETTopFET

    94Trace线路，走线，引线

    95Transferfunction传递函数

    96TripPoint跳变点

    97turnsratio匝数比，＝Np/Ns。（初级匝数/次级匝数）

    98UnderVoltageLockOut(UVLO)欠压锁定

    99VoltageReference电压参考

    100voltage-secondproduct伏秒积

    101zero-polefrequencycompensation零极点频率补偿

    102beatfrequency拍频

    103oneshots单击电路

    104scaling缩放

    105ESR等效串联电阻[Page]

    106Ground地电位

    107trimmedbandgap平衡带隙

    108dropoutvoltage压差

    109largebulkcapacitance大容量电容

    110circuitbreaker断路器

    111chargepump电荷泵

    112overshoot过冲

    LED照明常用词汇中英文对照(二)

    1）元件设备

    三绕组变压器：three-columntransformerThrClnTrans

    双绕组变压器：double-columntransformerDblClmnTrans

    电容器：Capacitor

    并联电容器：shuntcapacitor

    电抗器：Reactor

    母线：Busbar

    输电线：TransmissionLine

    发电厂：powerplant

    断路器：Breaker

    刀闸(隔离开关)：Isolator

    分接头：tap

    电动机：motor

    2）状态参数

    有功：activepower

    无功：reactivepower

    电流：current

    容量：capacity

    电压：voltage

    档位：tapposition

    有功损耗：reactiveloss

    无功损耗：activeloss

    功率因数：power-factor

    功率：power

    功角：power-angle

    电压等级：voltagegrade

    空载损耗：no-loadloss

    铁损：ironloss

    铜损：copperloss

    空载电流：no-loadcurrent

    阻抗：impedance

    正序阻抗：positivesequenceimpedance

    负序阻抗：negativesequenceimpedance

    零序阻抗：zerosequenceimpedance

    电阻：resistor

    电抗：reactance

    电导：conductance

    电纳：susceptance

    无功负载：reactiveload或者QLoad

    有功负载:activeloadPLoad

    遥测：YC(telemetering)

    遥信：YX

    励磁电流(转子电流)：magnetizingcurrent

    定子：stator

    功角：power-angle

    上限:upperlimit

    下限：lowerlimit

    并列的：apposable

    高压:highvoltage

    低压：lowvoltage

    中压：middlevoltage

    电力系统powersystem

    发电机generator

    励磁excitation

    励磁器excitor

    电压voltage

    电流current

    母线bus

    变压器transformer

    升压变压器step-uptransformer

    高压侧highside

    输电系统powertransmissionsystem

    输电线transmissionline

    固定串联电容补偿fixedseriescapacitorcompensation

    稳定stability

    电压稳定voltagestability

    功角稳定anglestability

    暂态稳定transientstability

    电厂powerplant

    能量输送powertransfer

    交流AC

    装机容量installedcapacity

    电网powersystem

    落点droppoint

    开关站switchstation

    双回同杆并架double-circuitlinesonthesametower

    变电站transformersubstation

    补偿度degreeofcompensation

    高抗highvoltageshuntreactor

    无功补偿reactivepowercompensation

    故障fault

    调节regulation

    裕度magin

    三相故障threephasefault

    故障切除时间faultclearingtime

    极限切除时间criticalclearingtime

    切机generatortriping

    高顶值highlimitedvalue

    强行励磁reinforcedexcitation

    线路补偿器LDC(linedropcompensation)

    机端generatorterminal

    静态static(state)

    动态dynamic(state)

    单机无穷大系统onemachine-infinitybussystem

    机端电压控制AVR

    电抗reactance

    电阻resistance

    功角powerangle

    有功（功率）activepower

    无功（功率）reactivepower

    功率因数powerfactor

    无功电流reactivecurrent

    下降特性droopcharacteristics

    斜率slope

    额定rating

    变比ratio

    参考值referencevalue

    电压互感器PT

    分接头tap

    下降率drooprate

    仿真分析simulationanalysis

    传递函数transferfunction

    框图blockdiagram

    受端receive-side

    裕度margin

    同步synchronization

    失去同步lossofsynchronization

    阻尼damping

    摇摆swing

    保护断路器circuitbreaker

    电阻：resistance

    电抗：reactance

    阻抗：impedance

    电导：conductance

    电纳：susceptance

    导纳：admittance

    电感：inductance

    电容:capacitance

    印制电路printedcircuit

    印制线路printedwiring

    印制板printedboard

    印制板电路printedcircuitboard

    印制线路板printedwiringboard

    印制元件printedcomponent

    印制接点printedcontact

    印制板装配printedboardassembly

    板board

    刚性印制板rigidprintedboard

    挠性印制电路flexibleprintedcircuit

    挠性印制线路flexibleprintedwiring

    齐平印制板flushprintedboard

    金属芯印制板metalcoreprintedboard

    金属基印制板metalbaseprintedboard

    多重布线印制板mulit-wiringprintedboard

    塑电路板moldedcircuitboard

    散线印制板discretewiringboard

    微线印制板microwireboard

    积层印制板buile-upprintedboard

    表面层合电路板surfacelaminarcircuit

    埋入凸块连印制板B2itprintedboard

    载芯片板chiponboard

    埋电阻板buriedresistanceboard

    母板motherboard

    子板daughterboard

    背板backplane

    裸板bareboard

    键盘板夹心板copper-invar-copperboard

    动态挠性板dynamicflexboard

    静态挠性板staticflexboard

    可断拼板break-awayplanel

    电缆cable

    挠性扁平电缆flexibleflatcable(FFC)

    薄膜开关membraneswitch

    混合电路hybridcircuit

    厚膜thickfilm

    厚膜电路thickfilmcircuit

    薄膜thinfilm

    薄膜混合电路thinfilmhybridcircuit

    互连interconnection

    导线conductortraceline

    齐平导线flushconductor

    传输线transmissionline

    跨交crossover

    板边插头edge-boardcontact

    增强板stiffener

    基底substrate

    基板面realestate

    导线面conductorside

    元件面componentside

    焊接面solderside

    导电图形conductivepattern

    非导电图形non-conductivepattern

    基材basematerial

    层压板laminate

    覆金属箔基材metal-cladbadematerial

    覆铜箔层压板copper-cladlaminate(CCL)

    复合层压板compositelaminate

    薄层压板thinlaminate

    基体材料basismaterial

    预浸材料prepreg

    粘结片bondingsheet

    预浸粘结片preimpregnatedbondingsheer

    环氧玻璃基板epoxyglasssubstrate

    预制内层覆箔板masslaminationpanel

    内层芯板corematerial

    粘结层bondinglayer

    粘结膜filmadhesive

    无支撑胶粘剂膜unsupportedadhesivefilm

    覆盖层coverlayer(coverlay)

    增强板材stiffenermaterial

    铜箔面copper-cladsurface

    去铜箔面foilremovalsurface

    层压板面uncladlaminatesurface

    基膜面basefilmsurface

    胶粘剂面adhesivefaec

    原始光洁面platefinish

    粗面mattfinish

    剪切板cuttosizepanel

    超薄型层压板ultrathinlaminate

    A阶树脂A-stageresin

    B阶树脂B-stageresin

    C阶树脂C-stageresin

    环氧树脂epoxyresin

    酚醛树脂phenolicresin

    聚酯树脂polyesterresin

    聚酰亚胺树脂polyimideresin

    双马来酰亚胺三嗪树脂bismaleimide-triazineresin

    丙烯酸树脂acrylicresin

    三聚氰胺甲醛树脂melamineformaldehyderesin

    多官能环氧树脂polyfunctionalepoxyresin

    溴化环氧树脂brominatedepoxyresin

    环氧酚醛epoxynovolac

    氟树脂fluroresin

    硅树脂siliconeresin

    硅烷silane

    聚合物polymer

    无定形聚合物amorphouspolymer

    结晶现象crystallinepolamer

    双晶现象dimorphism

    共聚物copolymer

    合成树脂synthetic

    热固性树脂thermosettingresin[Page]

    热塑性树脂thermoplasticresin

    感光性树脂photosensitiveresin

    环氧值epoxyvalue

    双氰胺dicyandiamide

    粘结剂binder

    胶粘剂adesive

    固化剂curingagent

    阻燃剂flameretardant

    遮光剂opaquer

    增塑剂plasticizers

    不饱和聚酯unsatuiatedpolyester

    聚酯薄膜polyester

    聚酰亚胺薄膜polyimidefilm(PI)

    聚四氟乙烯polytetrafluoetylene(PTFE)

    增强材料reinforcingmaterial

    折痕crease

    云织waviness

    鱼眼fisheye

    毛圈长featherlength

    厚薄段mark

    裂缝split

    捻度twistofyarn

    浸润剂含量sizecontent

    浸润剂残留量sizeresidue

    处理剂含量finishlevel

    偶联剂couplintagent

    断裂长breakinglength

    吸水高度heightofcapillaryrise

    湿强度保留率wetstrengthretention

    白度whitenness

    导电箔conductivefoil

    铜箔copperfoil

    压延铜箔rolledcopperfoil

    光面shinyside

    粗糙面matteside

    处理面treatedside

    防锈处理stainproofing

    双面处理铜箔doubletreatedfoil

    模拟simulation

    逻辑模拟logicsimulation

    电路模拟circitsimulation

    时序模拟timingsimulation

    模块化modularization

    设计原点designorigin

    优化（设计）optimization(design)

    供设计优化坐标轴predominantaxis

    表格原点tableorigin

    元件安置componentpositioning

    比例因子scalingfactor

    扫描填充scanfilling

    矩形填充rectanglefilling

    填充域regionfilling

    实体设计physicaldesign

    逻辑设计logicdesign

    逻辑电路logiccircuit

    层次设计hierarchicaldesign

    自顶向下设计top-downdesign

    自底向上设计bottom-updesign

    费用矩阵costmetrix

    元件密度componentdensity

    自由度degreesfreedom

    出度outgoingdegree

    入度incomingdegree

    曼哈顿距离manhattondistance

    欧几里德距离euclideandistance

    网络network

    阵列array

    段segment

    逻辑logic

    逻辑设计自动化logicdesignautomation

    分线separatedtime

    分层separatedlayer

    定顺序definitesequence

    导线（通道）conduction(track)

    导线（体）宽度conductorwidth

    导线距离conductorspacing

    导线层conductorlayer

    导线宽度/间距conductorline/space

    第一导线层conductorlayerNo.1

    圆形盘roundpad

    方形盘squarepad

    菱形盘diamondpad

    长方形焊盘oblongpad

    子弹形盘bulletpad

    泪滴盘teardroppad

    雪人盘snowmanpad

    形盘V-shapedpadV

    环形盘annularpad

    非圆形盘non-circularpad

    隔离盘isolationpad

    非功能连接盘monfunctionalpad

    偏置连接盘offsetland

    腹（背）裸盘back-bardland

    盘址anchoringspaur

    连接盘图形landpattern

    连接盘网格阵列landgridarray

    孔环annularring

    元件孔componenthole

    安装孔mountinghole

    支撑孔supportedhole

    非支撑孔unsupportedhole

    导通孔via

    镀通孔platedthroughhole(PTH)

    余隙孔accesshole

    盲孔blindvia(hole)

    埋孔buriedviahole

    埋,盲孔buriedblindvia

    任意层内部导通孔anylayerinnerviahole

    全部钻孔alldrilledhole

    定位孔toalinghole

    无连接盘孔landlesshole

    中间孔interstitialhole

    无连接盘导通孔landlessviahole

    引导孔pilothole

    端接全隙孔terminalclearomeehole

    准尺寸孔dimensionedhole[Page]

    在连接盘中导通孔via-in-pad

    孔位holelocation

    孔密度holedensity

    孔图holepattern

    钻孔图drilldrawing

    装配图assemblydrawing

    参考基准datumreferan