首次揭秘：英特尔制胜未来的半导体前沿技术储备

3D stacking of silicon die can provide system integration opportunities to mix different technologies into a small form factor.

硅晶片的3D堆叠有机会实现系统集成，以便把不同的技术混装到一个很小的地方。

A variety of dense memory options, including volatile and non-volatile memory, are being explored and developed.

多种不同的高密度内存选择，其中包括易失性和非易失性存储技术，正在探索和开发中。

Scaling interconnects is just as important as scaling transistors on advanced process technologies. Novel materials and patterning techniques are being explored to enable dense interconnects.

对于精尖制程工艺来说，微缩互联和微缩晶体管一样重要。新的材料和图案成形技术正在探索中，以支持高密度互联。

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Extreme Ultraviolet (EUV) lithography using a 13.5 nm wavelength is being developed to enable better scaling as today’s 193nm wavelength tools reach their scaling limit.

极紫外（EUV）光刻技术：采用13.5纳米波长。由于当今的193纳米波长工具已达到其微缩极限，该技术正在研发中以实现进一步的微缩。

Spintronics is a beyond-CMOS technology that promises very dense and low power circuits that are an option when CMOS can no longer be scaled.

自旋电子是一种超越CMOS的技术，当CMOS无法再进行微缩的时候，这是一种选择，可提供非常密集和低功耗的电路。

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Neuromorphic computing is a different processor design and architecture approach for performing some computing functions with much better power efficiency than today’s computers.

神经元计算是一种不同的处理器设计和架构，能够以比当前计算机高得多的能效执行某些计算功能。